Wylie BGA Reballing Stencil For iPhone – For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max
Roll over image to zoom in
Loading...
Apple iPhone BGA Chip reballing Stencil for Soldering IC Chips.
Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight.
Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate.
The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation – For iPhone 11 / 11 Mini / 11 Pro / 11 Pro Max
Additional information
| Product type | |
|---|---|
| Group brand | |
| Extra field |
Reviews
There are no reviews yet.