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QianLi 3D BGA Reballing Gold Stencil For iPhone 6/6 Plus

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  • Order before 18:00, receive tomorrow (NL/BE)
  • High quality products
  • Including 6 months warranty
SKU: APP13600 Category:

Apple iPhone 6G/iPhone 6 Plus BGA Chip reballing Stencil for Soldering IC Chips.
Please try to handle the repair or replacement work in a dry and dust free environment without direct sunlight.
Special tooling is required when disassembling and reassembling. You’d better be careful when you use the Tin-plating Plate.
The installation of any new parts should be done by a qualified person. UR is not responsible for any damage caused during installation

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